Display device and electronic device including the same

ABSTRACT

A display device includes a display panel including a first non-folding region, a second non-folding region, and a folding region between the first and second non-folding regions, and a lower member below the display panel. The lower member includes a support layer below the display panel and including a first support part which overlaps the first non-folding region, a second support part which overlaps the second non-folding region, and a folding part which overlaps the folding region, where openings are defined in the folding part, a digitizer below the support layer and corresponding to the first and support parts, a cover layer between the support layer and the digitizer and attached below the folding part, and a lower adhesion layer between the support layer and the digitizer. The lower adhesion layer is between the first and second support parts.

This application claims priority to Korean Patent Application No.10-2021-0077030, filed on Jun. 14, 2021, and all the benefits accruingtherefrom under 35 U.S.C § 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND 1. Field

Embodiments of the invention relate to a display device and anelectronic device including the display device, and more particularly,to a display device having improving reliability and waterproofproperties.

2. Description of the Related Art

An electronic device may include an active section that is activatedwith an electrical signal. The electronic device may use the activesection to detect externally applied inputs and to display variousimages to provide users with information. With the development ofvariously shaped electronic devices, the active section may have variousshapes.

SUMMARY

Embodiments of the invention provide a display device having improvingreliability and waterproof properties and an electronic device includingthe display device.

According to an embodiment of the invention, a display device includes:a display panel which includes a first non-folding region, a secondnon-folding region, and a folding region between the first non-foldingregion and the second non-folding region; and a lower member below thedisplay panel. In such an embodiment, the lower member includes: asupport layer below the display panel, where the support layer includesa first support part which overlaps the first non-folding region, asecond support part which overlaps the second non-folding region, and afolding part which overlaps the folding region, where a plurality ofopenings is defined in the folding part; a digitizer below the supportlayer, where the digitizer corresponds to the first support part and thesecond support part; a cover layer between the support layer and thedigitizer, where the cover layer is attached below the folding part; anda lower adhesion layer between the support layer and the digitizer. Insuch an embodiment, the lower adhesion layer is below the first supportpart and the second support part.

In an embodiment, a thickness of the lower adhesion layer may be greaterthan a thickness of the cover layer.

In an embodiment, the thickness of the lower adhesion layer may be in arange of about 15 micrometers to about 25 micrometers. In such anembodiment, the thickness of the cover layer may be in a range of about10 micrometers to about 20 micrometers.

In an embodiment, the cover layer may include at least one selected fromthermoplastic polyurethane (“TPU”), rubber, and silicon.

In an embodiment, the first support part, the folding part, and thesecond support part may be sequentially arranged along a firstdirection. In such an embodiment, a first width in the first directionof the folding part may be less by a distance in a range of about 0.5micrometers to about 3 micrometers than a second width in the firstdirection of the cover layer.

In an embodiment, the digitizer may include: a first digitizer having afirst sensing area which corresponds to the first support part; and asecond digitizer having a second sensing area which corresponds to thesecond support part. In such an embodiment, the second digitizer may bespaced apart from the first digitizer.

In an embodiment, the lower adhesion layer may include: a first loweradhesion layer in contact with a bottom surface of the first supportpart and with a top surface of the first digitizer; and a second loweradhesion layer in contact with a bottom surface of the second supportpart and with a top surface of the second digitizer.

In an embodiment, the digitizer may include: a base layer; and aplurality of coils on one surface of the base layer. In such anembodiment, the lower adhesion layer may cover an undulation on a topsurface of the digitizer, where the undulation may be defined by theplurality of coils.

In an embodiment, the support layer may include a non-metallic material.

In an embodiment, the cover layer may be in contact with a bottomsurface of the folding part and may be spaced apart from the digitizer.

In an embodiment, the lower member may further include: anelectromagnetic shield layer below the digitizer; a lower metal platebelow the electromagnetic shield layer; and a thermal radiation layerbelow the lower metal plate.

In an embodiment, the display device may further include: an inputsensor directly on the display panel; and an antireflection layerdirectly on the input sensor.

In an embodiment, the antireflection layer may include: a plurality ofcolor filters; and a partition layer between the plurality of colorfilters.

In an embodiment, the display panel may include: a display region whichincludes a first display region and a second display region adjacent tothe first display region; and a peripheral region adjacent to thedisplay region. In such an embodiment, the first display region may havean optical transmittance relatively greater than an opticaltransmittance of the second display region.

In an embodiment, the lower member may further include: a barrier layerbelow the display panel; a first adhesion part which attaches thebarrier layer and the first support part to each other; and a secondadhesion part which attaches the barrier layer and the second supportpart to each other. In such an embodiment, the second adhesion part maybe spaced apart from the first adhesion part. In such an embodiment, aninterval between the first adhesion part and the second adhesion partmay be greater than an interval between the first support part and thesecond support part.

According to an embodiment of the invention, a display device includes;a display panel which includes a first non-folding region, a secondnon-folding region, and a folding region between the first non-foldingregion and the second non-folding region; and a lower member below thedisplay panel. In such an embodiment, the lower member may include: asupport layer below the display panel; a digitizer below the supportlayer; a lower adhesion layer in contact with a bottom surface of thesupport layer and with a top surface of the digitizer; and a cover layerin contact with the bottom surface of the support layer. In such anembodiment, the cover layer does not overlap the lower adhesion layerwhen viewed in a plan view.

In an embodiment, the digitizer may include: a base layer; and aplurality of coils on one surface of the base layer. In such anembodiment, the lower adhesion layer may cover an undulation on the topsurface of the digitizer, where the undulation may be defined by theplurality of coils.

According to an embodiment of the invention, an electronic deviceincludes: a display device which includes a signal transmission regionthrough which an optical signal passes, a display region adjacent to thesignal transmission region, and a non-display region adjacent to thedisplay region, where the signal transmission region includes an elementarea which a light-emitting element overlaps and a transmission areawhich the light-emitting element does not overlap; and an electronicmodule below the display device, where the electronic module overlapsthe signal transmission region. In such an embodiment, the displaydevice includes: a display panel which includes a first non-foldingregion, a second non-folding region, and a folding region between thefirst non-folding region and the second non-folding region; and a lowermember below the display panel. In such an embodiment, the lower memberincludes: a support layer below the display panel, the support layerincluding a first support part which overlaps the first non-foldingregion, a second support part which overlaps the second non-foldingregion, and a folding part which overlaps the folding region, where aplurality of openings is defined in the folding part; a digitizer belowthe support layer, where the digitizer corresponds to the first supportpart and the second support part; a cover layer between the supportlayer and the digitizer, where the cover layer is attached below thefolding part; and a lower adhesion layer between the support layer andthe digitizer. In such an embodiment, the lower adhesion layer is belowthe first support part and the second support part.

In an embodiment, the display device may further include a window. Insuch an embodiment, the window may include a base film and a bezelpattern which does not overlap the non-display region.

In an embodiment, the electronic module may include a camera module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C illustrate perspective views showing an electronic deviceaccording to an embodiment of the invention.

FIG. 2 illustrates an exploded perspective view showing an electronicdevice according to an embodiment of the invention.

FIG. 3 illustrates a block diagram showing an electronic deviceaccording to an embodiment of the invention.

FIG. 4 illustrates a cross-sectional view showing a display moduleaccording to an embodiment of the invention.

FIG. 5 illustrates a cross-sectional view partially showing a displaymodule according to an embodiment of the invention.

FIG. 6A illustrates a plan view showing a display panel according to anembodiment of the invention.

FIG. 6B illustrates an enlarged plan view partially showing a displaypanel according to an embodiment of the invention.

FIG. 6C illustrates an enlarged plan view partially showing a displaypanel according to an embodiment of the invention.

FIG. 7A illustrates a cross-sectional view showing a display deviceaccording to an embodiment of the invention.

FIG. 7B illustrates a cross-sectional view showing a display deviceaccording to an embodiment of the invention.

FIGS. 7C and 7D illustrate cross-sectional views partially showing adisplay device according to an embodiment of the invention.

FIG. 8 illustrates a cross-sectional view a lower member according to anembodiment of the invention.

FIG. 9A illustrates a plan view showing a digitizer according to anembodiment of the invention.

FIG. 9B illustrates a plan view showing a sensing area of a digitizeraccording to an embodiment of the invention.

FIG. 9C illustrates a cross-sectional view showing a sensing area of adigitizer according to an embodiment of the invention.

FIG. 9D illustrates a cross-sectional view showing a lower adhesionlayer and a portion of a digitizer according to an embodiment of theinvention.

DETAILED DESCRIPTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areshown. This invention may, however, be embodied in many different forms,and should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art.

In this disclosure, when a certain component (or region, layer, portion,etc.) is referred to as being “on”, “connected to”, or “coupled to”other component(s), the certain component may be directly disposed on,directly connected to, or directly coupled to the other component(s) orat least one intervening component may be present therebetween. Incontrast, when an element is referred to as being “directly on” anotherelement, there are no intervening elements present.

Like numerals indicate like components. Moreover, in the drawings,thicknesses, ratios, and dimensions of components are exaggerated foreffectively explaining the technical contents.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein,“a”, “an,” “the,” and “at least one” do not denote a limitation ofquantity, and are intended to include both the singular and plural,unless the context clearly indicates otherwise. For example, “anelement” has the same meaning as “at least one element,” unless thecontext clearly indicates otherwise. “At least one” is not to beconstrued as limiting “a” or “an.” “Or” means “and/or.” As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items. It will be further understood that theterms “comprises” and/or “comprising,” or “includes” and/or “including”when used in this specification, specify the presence of statedfeatures, regions, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, regions, integers, steps, operations, elements,components, and/or groups thereof.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Unless otherwise defined, all terms used herein including technical andscientific terms have the same meaning generally understood by one ofordinary skilled in the art. Also, terms as defined in dictionariesgenerally used should be understood as having meaning identical ormeaning contextually defined in the art and should not be understood asideally or excessively formal meaning unless definitely defined herein.

Embodiments are described herein with reference to cross sectionillustrations that are schematic illustrations of idealized embodiments.As such, variations from the shapes of the illustrations as a result,for example, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments described herein should not be construed aslimited to the particular shapes of regions as illustrated herein butare to include deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as flatmay, typically, have rough and/or nonlinear features. Moreover, sharpangles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, embodiments of the invention will be described in detailwith reference to the accompanying drawings.

FIGS. 1A to 1C illustrate perspective views showing an electronic deviceED according to an embodiment of the invention. FIG. 1A shows anembodiment of the electronic device ED in an unfolded state, and FIGS.1B and 1C show an embodiment of the electronic device ED in a foldedstate.

Referring to FIGS. 1A to 1C, an embodiment of the electronic device EDmay include a display surface DS defined by a first direction DR1 and asecond direction DR2 that intersects the first direction DR1. Theelectronic device ED may use the display surface DS to provide userswith an image IM.

In an embodiment, the display surface DS may include a display region DAand a non-display region NDA around the display region DA. The displayregion DA may display the image IM, and the non-display region NDA maynot display the image IM. The non-display region NDA may surround thedisplay region DA. The invention, however, is not limited thereto, andthe display region DA and the non-display region NDA may be changed inshape.

The display surface DS may further include a signal transmission regionTA. The signal transmission region TA may be a portion of the displayregion DA or a portion of the non-display region NDA. As illustrated inFIG. 1A, the signal transmission region TA may be a portion of thedisplay region DA. The signal transmission region TA may have atransmittance greater than that of the display region DA and that of thenon-display region NDA. Natural light, visible light, or infrared lightmay be emitted toward the signal transmission region TA. The electronicdevice ED may further include either a camera module that captures anexternal image by using the visible light that passes through the signaltransmission region TA or a sensor module that uses the infrared lightto determine access of external objects.

Differently from that shown in FIG. 1A, in an alternative embodiment ofthe invention, the signal transmission region TA may extend from thenon-display region NDA without being spaced apart from the non-displayregion NDA. The signal transmission region TA may be provided in plural.In an embodiment, the signal transmission region TA may include aplurality of transmission regions TA1 and TA2, through which differenttypes of light are transmitted, respectively.

A third direction DR3 is defined hereinafter as a direction thatsubstantially vertically intersects a plane formed by the first andsecond directions DR1 and DR2. Herein, the phrase “when viewed in a planview” may be defined to include the meaning of “when viewed in the thirddirection DR3.”

In an embodiment, the electronic device ED may include a folding regionFA and a plurality of non-folding regions NFA1 and NFA2. The non-foldingregions NFA1 and NFA2 may include a first non-folding region NFA1 and asecond non-folding region NFA2. When viewed in the third direction DR3,the first non-folding region NFA1 and the second non-folding region NFA2are spaced apart from each other in the second direction DR2, and thefolding region FA may be disposed between the first non-folding regionNFA1 and the second non-folding region NFA2.

In an embodiment, as illustrated in FIG. 1B, the folding region FA maybe foldable about a folding axis FX parallel to the first direction DR1.The folding region FA may have a certain curvature and a curvatureradius R1. The first non-folding region NFA1 and the second non-foldingregion NFA2 may face each other, and the electronic device ED may be inan inner-folding state such that the display surface DS may not beexternally exposed.

In an embodiment of the invention, the electronic device ED may be in anouter-folding state such that the display surface DS may be externallyexposed. In an embodiment of the invention, the electronic device ED maybe configured to reciprocally repeat the inner-folding and/orouter-folding state from an unfolding state. In an embodiment of theinvention, the electronic device ED may be configured to perform one ofa folding operation, an inner-folding operation, and an outer-foldingoperation.

In an embodiment, as illustrated in FIG. 1B, a distance between thefirst non-folding region NFA1 and the second non-folding region NFA2 maybe substantially the same as the curvature radius R1, but not beinglimited thereto. Alternatively, as shown in FIG. 1C, the distancebetween the first non-folding region NFA1 and the second non-foldingregion NFA2 may be less than the curvature radius R1. FIGS. 1B and 1Cshow an embodiment of the electronic device ED where a casing (see EDCof FIG. 2 ) is omitted for convenience of illustration. In such anembodiment, the casing EDC that constitutes an appearance of theelectronic device ED may be in contact with each other at ends of thefirst and second non-folding regions NFA1 and NFA2 in a folded state.

FIGS. 1A to 1C show an embodiment of the electronic device ED includinga single folding region FA arranged between two non-folding regions NFA1and NFA2, but not being limited thereto. Alternatively, the electronicdevice ED may include a plurality of folding regions to have a structurecapable of being folded several times.

FIG. 2 illustrates an exploded perspective view showing the electronicdevice ED according to an embodiment of the invention. FIG. 3illustrates a block diagram showing the electronic device ED accordingto an embodiment of the invention. FIG. 4 illustrates a cross-sectionalview showing a display module DM according to an embodiment of theinvention. FIG. 4 shows a cross-section that corresponds to that takenalong line I-I′ of FIG. 2 .

In an embodiment, as shown in FIG. 2 , the electronic device ED mayinclude a display device DD, a control module EM, a power module PSM, anelectronic module ELM, and a casing EDC. Although not shown separately,the power module PSM may include a mechanism structure that controls afolding operation of the display device DD.

In an embodiment, the display device DD generates an image and detectsan external input. The display device DD includes a window module WM anda display module DM. The window module WM provides or defines a frontsurface of the electronic device ED.

The display module DM may include a display panel DP. FIG. 2 shows onlythe display panel DP in a stack structure of the display module DM, forconvenience of illustration, but not being limited thereto. In such anembodiment, the display module DM may further include a plurality ofcomponents located above and below the display panel DP. The stackstructure of the display module DM will hereinafter be discussed indetail.

The display panel DP includes a display region DP-DA and a non-displayregion DP-NDA that respectively correspond to the display region (see DAof FIG. 1A) and the non-display region (see NDA of FIG. 1A) of theelectronic device ED. Herein, the phrase “a region/part corresponds to aregion/part” may mean “a region/part overlaps a region/part”, whichinterpretation is not limited to the meaning of “a region/part has thesame area as that of a region/part.” The display module DM may include adriver chip DIC disposed on the non-display region DP-NDA. The displaymodule DM may further include a printed circuit board (“PCB”) combinedwith the non-display region DP-NDA.

The display panel DP may further include a signal transmission regionDP-TA. The signal transmission region DP-TA may be an aperture or a zone(or area) whose resolution is less than that of the display regionDP-DA. Therefore, the signal transmission region DP-TA has atransmittance greater than that of the display region DP-DA and that ofthe non-display region DP-NDA. The signal transmission region DP-TA ofthe display panel DP may be a zone that corresponds to the signaltransmission region TA of the electronic device ED described above. Thesignal transmission region DP-TA may include a first signal transmissionregion DP-TA1 that corresponds to a camera module CM which will bediscussed below and a second signal transmission region DP-TA2 thatcorresponds to a sensor module SM which will be discussed below.

The driver chip DIC may include driving elements, such as data drivercircuit, for driving pixels of the display panel DP. FIG. 2 shows anembodiment having a structure in which the driver chip DIC is mounted onthe display panel DP, but the invention is not limited thereto. In anembodiment, for example, the driver chip DIC may be mounted on a printedcircuit board PCB.

The control module EM includes at least a main controller 10. In anembodiment, the control module EM may include the main controller 10, awireless communications module 20, an image input module 30, an acousticinput module 40, an acoustic output module 50, a memory 60, and anexternal interface module 70. The modules may be mounted on the printedcircuit board PCB or may be electrically connected through a flexiblecircuit board to the printed circuit board PCB. The control module EMmay be electrically connected to the power module PSM.

The main controller 10 controls overall operation of the electronicdevice ED. In an embodiment, for example, the main controller 10activates or deactivates the display device DD in response to user'sinputs. In such an embodiment, the main controller 10 may control theimage input module 30, the acoustic input module 40, and the acousticoutput module 50 based on user's inputs. The main controller 10 mayinclude at least one microprocessor.

The wireless communications module 20 may use Bluetooth® or WiFi®communications to transceive wireless signals with other terminals. Thewireless communications module 20 may use a conventional communicationssystem to transceive speech signals. The wireless communications module20 includes a transmitter circuit 22 that modulates and transmitssignals, and also includes a receiver circuit 24 that demodulatesreceived signals.

The image input module 30 processes and converts image signals intoimage data capable of being displayed on the display device DD. In arecord module or a speech mode, the acoustic input module 40 receivesexternal sound signals through a microphone and converts the receivedsound signals into electrical voice data. The acoustic output module 50converts and outputs sound data that is received from the wirelesscommunications module 20 or is stored in the memory 60.

The external interface module 70 serves as an interface connected to anexternal charger, a wire/wireless data port, a card socket (e.g., memorycard, SIM/UIM card).

The power module PSM supplies power used for overall operation of theelectronic device ED. The power module PSM may include a battery module,for example.

The casing EDC accommodates the display module DM, the control moduleEM, the power module PSM, and the electronic module ELM. In anembodiment, as shown in FIG. 2 , the casing EDC may include two casingsEDC1 and EDC2 that are separated from each other, but the invention isnot limited thereto. Although not shown, the electronic device ED mayfurther include a hinge structure that connects the two casings EDC1 andEDC2 to each other. The casing EDC may be combined with the windowmodule WM. The casing EDC protects the display module DM, the controlmodule EM, the power module PSM, and the electronic module ELM that areaccommodated in the casing EDC.

The electronic module ELM may be an electric component that outputs orreceives optical signals. The electronic module ELM transmits opticalsignals through a partial region of the electronic device ED, whichpartial region corresponds to the signal transmission region (see TA ofFIG. 1A). In an embodiment, the electronic module ELM may include acamera module CM. The camera module CM may capture external images fromnatural light signals received through the first signal transmissionregion DP-TA′. The electronic module ELM may include a sensor module SM,such as a proximity sensor or an ultraviolet light-emitting sensor. Thesensor module SM may recognize a user's body part (e.g., fingerprint,iris, or face) through the second signal transmission region DP-TA2 ormay measure a distance between an object and a mobile phone through thesecond signal transmission region DP-TA2.

The electronic module ELM is disposed below the display device DD. Theelectronic module ELM is disposed to correspond to the signaltransmission region (see TA of FIG. 1A) of the electronic device ED. Inan embodiment, for example, the electronic module ELM overlaps thesignal transmission region DP-TA of the display panel DP. The signaltransmission region DP-TA of the display panel DP may be a zone whoseoptical transmittance is greater than those of other zones of thedisplay panel DP.

Referring to FIG. 4 , the display module DM may include the displaypanel DP, an input sensor IS disposed on the display panel DP, anantireflection layer LF disposed on the input sensor IS, and a lowermember LM disposed below the display panel DP. Alternatively, one ormore adhesion layers may be selectively provided or disposed between thecomponents mentioned above.

The display panel DP may include a base layer, a circuit element layerdisposed on the base layer, a display element layer disposed on thecircuit element layer, and a thin-film encapsulation layer disposed onthe display element layer. The base layer may include a plastic film. Inan embodiment, for example, the base layer may include polyimide. In anembodiment, the base layer may have a planar shape the same as that ofthe display panel DP shown in FIG. 6A which will be discussed below.

The circuit element layer may include an organic layer, an inorganiclayer, a semiconductor pattern, a conductive pattern, and a signal line.In an embodiment, a coating process and/or a deposition process may beemployed to form the organic layer, the inorganic layer, thesemiconductor layer, and the conductive layer on the base layer. In suchan embodiment, a photolithography process may be performed several timesafter the coating process and/or the deposition process such that theorganic layer, the inorganic layer, the semiconductor layer, and theconductive layer may be selectively patterned to form the semiconductorpattern, the conductive pattern, and the signal line.

The semiconductor pattern, the conductive pattern, and the signal linemay form or define signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2,and PL and a pixel driver circuit of pixels PX shown in FIG. 6A whichwill be discussed below. The pixel driver circuit may include at leastone transistor.

The display element layer includes light-emitting elements of pixels PXshown in FIG. 6A. The light-emitting element is electrically connectedto the at least one transistor. The thin-film encapsulation layer may bedisposed on and encapsulate the circuit element layer. The thin-filmencapsulation layer may include an inorganic layer, an organic layer,and an inorganic layer that are sequentially stacked. However, the stackstructure of the thin-film encapsulation layer is not particularlylimited.

The input sensor IS may include a plurality of sensing electrodes (notshown) that detect external inputs, a plurality of trace lines (notshown) connected to the plurality of sensing electrodes, and one or moreof inorganic and organic layers that insulate and/or protect theplurality of sensing electrodes or the plurality of trace lines. Theinput sensor IS may be a capacitive sensor, but the invention is notparticularly limited thereto.

When the display panel DP is fabricated, a series of processes may beemployed to directly form the input sensor IS on the thin-filmencapsulation layer. The invention, however, is not limited thereto, andalternatively, the input sensor IS may be separately fabricated in theform of a panel and may then be attached through an adhesion layer tothe display panel DP.

The antireflection layer LF may reduce a reflectance of external light.The antireflection layer LF may include one or more of a retarder and apolarizer. The antireflection layer LF may include at least a polarizingfilm. Alternatively, the antireflection layer LF may include colorfilters. The color filters may be arranged in a certain manner. Thearrangement of the color filters may be determined based on colors oflight emitted from pixels included in the display panel DP. Theantireflection layer LF may further include a partition layer adjacentto the color filters.

The lower member LM may include various functional members. In anembodiment, for example, the lower member LM may include a light-shieldlayer that blocks incident light, an impact-absorbing layer that absorbsexternal impact, a support layer that supports the display panel DP, anda thermal radiation layer that discharges heat generated from thedisplay panel DP. However, the stack structure of the lower member LM isnot particularly limited.

FIG. 5 illustrates a cross-sectional view partially showing the displaymodule DM according to an embodiment of the invention. FIG. 5 shows indetail the display panel DP, the input sensor IS, and the antireflectionlayer LF of the display module DM shown in FIG. 4 , which components DP,IS, and LF are arranged to correspond to a single pixel.

FIG. 5 shows a single light-emitting element LD, and also shows asilicon transistor S-TFT and an oxide transistor O-TFT that are includedin a pixel circuit PC. The oxide transistor O-TFT may be one of aplurality of transistors included in the pixel circuit PC, and thesilicon transistor S-TFT may another one of a plurality of transistorsincluded in the pixel circuit PC.

A buffer layer BFL may be disposed on a base layer BL. The buffer layerBFL may prevent metal elements or impurities from diffusing from thebase layer BL toward a first semiconductor pattern SP1 on the bufferlayer BFL. The first semiconductor pattern SP1 includes an activesection AC1 of the silicon transistor S-TFT. The buffer layer BFL maycontrol the rate of introduction of heat during a crystallizationprocess for the formation of the first semiconductor pattern SP1.

A first backside metal layer BMLa may be disposed below the silicontransistor S-TFT, and a second backside metal layer BMLb may be disposedbelow the oxide transistor O-TFT. The first and second backside metallayers BMLa and BMLb may be located overlapping the pixel circuit PC.The first and second backside metal layers BMLa and BMLb may blockexternal light from reaching the pixel circuit PC.

The first backside metal layer BMLa may be disposed to correspond to atleast a partial area of the pixel circuit PC. The first backside metallayer BMLa may be disposed to overlap a driver transistor defined by thesilicon transistor S-TFT.

The first backside metal layer BMLa may be disposed between the baselayer BL and the buffer layer BFL. In an embodiment of the invention, aninorganic barrier layer may further be disposed between the firstbackside metal layer BMLa and the buffer layer BFL. The first backsidemetal layer BMLa may be connected to an electrode or a wiring line, andmay receive a constant voltage or a signal from the electrode or thewiring line. According to an embodiment of the invention, the firstbackside metal layer BMLa may be a floating electrode that is isolatedfrom other electrodes or wiring lines.

The second backside metal layer BMLb may be disposed below the oxidetransistor O-TFT. The second backside metal layer BMLb may be placedbetween a second dielectric layer IL2 and a third dielectric layer IL3.The second backside metal layer BMLb may be located at a same level (ordisposed in a same layer) as that of a second electrode CE20 of astorage capacitor Cst. The second backside metal layer BMLb may beconnected to a contact electrode BML2-C, and may receive a constantvoltage or a signal from the contact electrode BML2-C. The contactelectrode BML2-C may be located at a same level (or disposed in a samelayer) as that of a gate GT2 of the oxide transistor O-TFT.

Each of the first and second backside metal layers BMLa and BMLb mayinclude reflective metal. In an embodiment, for example, each of thefirst and second backside metal layers BMLa and BMLb may include silver(Ag), an alloy containing silver (Ag), molybdenum (Mo), an alloycontaining molybdenum (Mo), aluminum (Al), an alloy containing aluminum(Al), aluminum nitride (AlN), tungsten (W), tungsten nitride (WN),copper (Cu), or p+ doped amorphous silicon. The first and secondbackside metal layers BMLa and BMLb may include a same material as eachother or different materials from each other.

Although not shown separately, according to an embodiment of theinvention, the second backside metal layer BMLb may be omitted. Thefirst backside metal layer BMLa may extend to a zone below the oxidetransistor O-TFT, and may thus block incidence of light on the zonebelow the oxide transistor O-TFT.

The first semiconductor pattern SP1 may be disposed on the buffer layerBFL. The first semiconductor pattern SP1 may include a siliconsemiconductor. The silicon semiconductor may include, for example,amorphous silicon or polycrystalline silicon. In an embodiment, forexample, the first semiconductor pattern SP1 may include low-temperaturepolysilicon.

FIG. 5 shows only the first semiconductor pattern SP1 located on thebuffer layer BFL for convenience of illustration, but the firstsemiconductor pattern SP1 may further be placed on other regions. Thefirst semiconductor pattern SP1 may be arranged over pixels. The firstsemiconductor pattern SP1 may have electrical properties that arechanged based on whether the first semiconductor pattern SP1 is doped ornot. The first semiconductor pattern SP1 may include a first regionwhose conductivity is high and a second region whose conductivity islow. The first region may be doped with n-type or p-type impurities. Ap-type transistor may include a doped region implanted with p-typeimpurities, and an n-type transistor may include a doped regionimplanted with n-type impurities. The second region may be an undopedregion or may be a doped region implanted with impurities whoseconcentration is lower than that of impurities doped in the firstregion.

The first region may have conductivity greater than that of the secondregion, and may substantially serve as an electrode or a signal line.The second region may substantially correspond to an active section (orchannel) of a transistor. In an embodiment, for example, a portion ofthe first semiconductor pattern SP1 may be an active section of atransistor, another portion of the first semiconductor pattern SP1 maybe a source or drain of the transistor, and still another portion of thefirst semiconductor pattern SP1 may be a connection electrode or aconnection signal line.

The silicon transistor S-TFT may include a source section SE1 (orsource), an active section AC1 (or channel), and a drain section DE1 (ordrain), all of which are formed from the first semiconductor patternSP1. When viewed in cross-section, the source section SE1 and the drainsection DE1 may extend in opposite directions from the active sectionAC1.

A first dielectric layer IL1 may be disposed on the buffer layer BFL.The first dielectric layer IL1 may commonly overlap a plurality ofpixels and may cover the first semiconductor pattern SP1. The firstdielectric layer IL1 may be an inorganic layer and/or an organic layer,and may have a single-layered or multi-layered structure. The firstdielectric layer IL1 may include at least one selected from aluminumoxide, titanium oxide, silicon oxide, silicon nitride, siliconoxynitride, zirconium oxide, and hafnium oxide. In an embodiment, thefirst dielectric layer IL1 may be a single-layered silicon oxide layer.Likewise the first dielectric layer ILL a dielectric layer of a circuitlayer DP-CL which will be discussed below may be an inorganic layerand/or an organic layer, and may have a single-layered or multi-layeredstructure. The inorganic layer may include at least one of the materialsmentioned above, but the invention is not limited thereto.

A gate GT1 of the silicon transistor S-TFT is disposed on the firstdielectric layer IL1. The gate GT1 may be a portion of a metal pattern.The gate GT1 overlaps the active section AC1. The gate GT1 may serve asa mask used in a process where the first semiconductor pattern SP1 isdoped. The gate GT1 may include titanium (Ti), silver (Ag), an alloycontaining silver (Si), molybdenum (Mo), an alloy containing molybdenum(Mo), aluminum (Al), an alloy containing aluminum (Al), aluminum nitride(AlN), tungsten (W), tungsten nitride (WN), copper (Cu), indium tinoxide (“ITO”), or indium zinc oxide (“IZO”), but the invention is notparticularly limited thereto.

The second dielectric layer IL2 may be disposed on the first dielectriclayer IL′, and may cover the gate GT1 of the silicon transistor S-TFT.The third dielectric layer IL3 may be disposed on the second dielectriclayer IL2. In an embodiment, the second electrode CE20 of the storagecapacitor Cst may be disposed between the second dielectric layer IL2and the third dielectric layer IL3. In such an embodiment, a firstelectrode CE10 of the storage capacitor Cst may be disposed between thefirst dielectric layer IL1 and the second dielectric layer IL2.

A second semiconductor pattern SP2 may be disposed on the thirddielectric layer IL3. The second semiconductor pattern SP2 may includean active section AC2 of the oxide transistor O-TFT which will bediscussed below. The second semiconductor pattern SP2 may include anoxide semiconductor. The second semiconductor pattern SP2 may includetransparent conductive oxide (“TCO”), such as ITO, IZO, indium galliumzinc oxide (“IGZO”), zinc oxide (ZnO), or indium oxide (In₂O₃).

An oxide semiconductor may include a plurality of regions that aredivided based on whether transparent conductive oxide is reduced or not.An area (or reducing area) where transparent conductive oxide is reducedhas conductivity greater than that of an area (or non-reducing area)where transparent conductive oxide is not reduced. The reducing areasubstantially has a role as or defines a signal line or a source/drainof a transistor. The non-reducing area substantially corresponds to asemiconductor section (or active section or channel) of a transistor. Insuch an embodiment, a portion of the second semiconductor pattern SP2may be a semiconductor section of a transistor, another portion of thesecond semiconductor pattern SP2 may be a source/drain section of thetransistor, and still another portion of the second semiconductorpattern SP2 may be a signal transfer section.

The oxide transistor O-TFT may include a source section SE2 (or source),an active section AC2 (or channel), and a drain section DE2 (or drain),all of which are formed from the second semiconductor pattern SP2. Whenviewed in cross-section, the source section SE2 and the drain sectionDE2 may extend in opposite directions from the active section AC2.

A fourth dielectric layer IL4 may be disposed on the third dielectriclayer IL3. In an embodiment, as illustrated in FIG. 5 , the fourthdielectric layer IL4 may be a dielectric pattern that overlaps the gateGT2 of the oxide transistor O-TFT and exposes the source and drainsections SE2 and DE2 of the oxide transistor O-TFT. The fourthdielectric layer IL4 may cover the second semiconductor pattern SP2.

In an embodiment, as illustrated in FIG. 5 , the gate GT2 of the oxidetransistor O-TFT is disposed on the fourth dielectric layer IL4. Thegate GT2 of the oxide transistor O-TFT may be a portion of a metalpattern. The gate GT2 of the oxide transistor O-TFT overlaps the activesection AC2 of the oxide transistor O-TFT.

A fifth dielectric layer IL5 may be disposed on the fourth dielectriclayer IL4, and may cover the gate GT2 of the oxide transistor O-TFT. Afirst connection electrode CNE1 may be disposed on the fifth dielectriclayer IL5. The first connection electrode CNE1 may be coupled to thedrain section DE1 of the silicon transistor S-TFT through a contact holethat penetrates the first, second, third, fourth, and fifth dielectriclayers Ill, IL2, IL3, IL4, and IL5.

A sixth dielectric layer IL6 may be disposed on the fifth dielectriclayer IL5. A second connection electrode CNE2 may be disposed on thesixth dielectric layer IL6. The second connection electrode CNE2 may becoupled to the first connection electrode CNE1 through a contact holethat penetrates the sixth dielectric layer IL6. A seventh dielectriclayer IL7 may be disposed on the sixth dielectric layer IL6, and maycover the second connection electrode CNE2. An eighth dielectric layerIL8 may be disposed on the seventh dielectric layer IL7.

Each of the sixth, seventh, and eighth dielectric layers IL6, IL7, andIL8 may be an organic layer. In an embodiment, for example, each of thesixth, seventh, and eighth dielectric layers IL6, IL7, and IL8 mayinclude a general universal polymer such as benzocyclobutene (“BCP”),polyimide, hexamethyldisiloxane (“HMDSO”), polymethylmethacrylate(“PMMA”), and polystyrene (“PS”), a polymer derivative having a phenolgroup, an acryl-based polymer, an imide-based polymer, an arylether-based polymer, an amide-based polymer, a fluoride-based polymer, ap-xylene-based polymer, a vinyl alcohol-based polymer, or a combination(e.g., a blend) thereof.

The light-emitting element LD may include a first electrode AE, anemission layer EL, and a second electrode CE. The second electrode CEmay be provided in common on a plurality of light-emitting elements.

The first electrode AE of the light-emitting element LD may be disposedon the eighth dielectric layer IL8. The first electrode AE of thelight-emitting element LD may be a transmissive electrode, atransflective electrode, or a reflective electrode. According to anembodiment of the invention, the first electrode AE of thelight-emitting element LD may include a reflective layer that includesor is formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or any compoundthereof and a transparent or transflective electrode layer that isdisposed on the reflective layer. The transparent or transflectiveelectrode layer may include or be formed of at least one selected fromITO, IZO, IGZO, zinc oxide (ZnO), indium oxide (In₂O₃), andaluminum-doped zinc oxide (“AZO”). In an embodiment, for example, thefirst electrode AE of the light-emitting element LD may include a stackstructure of ITO/Ag/ITO.

A pixel definition layer PDL may be disposed on the eighth dielectriclayer IL8. The pixel definition layer PDL may exhibit light-absorbingproperties and may have, for example, a black color. The pixeldefinition layer PDL may include a black coloring agent. The blackcoloring agent may include a black dye or a black pigment. The blackcoloring agent may include one of carbon blacks, metals such aschromium, and oxides thereof. The pixel definition layer PDL maycorrespond to a light-shield pattern having light-shield properties.

The pixel definition layer PDL may cover a portion of the firstelectrode AE of the light-emitting element LD. In an embodiment, forexample, the pixel definition layer PDL may have an opening PDL-OP thatexposes a portion of the first electrode AE of the light-emittingelement LD. The pixel definition layer PDL may increase a distancebetween the second electrode CE and an edge of the first electrode AE ofthe light-emitting element LD. Therefore, the pixel definition layer PDLmay serve to prevent the occurrence of arc at the edge of the firstelectrode AE.

Although not shown, a hole control layer may be disposed between thefirst electrode AE and the emission layer EL. The hole control layer mayinclude a hole transport layer and may further include a hole injectionlayer. An electrode control layer may be disposed between the emissionlayer EL and the second electrode CE. The electrode control layer mayinclude an electrode transport layer and may further include anelectrode injection layer. An open mask may be used such that the holecontrol layer and the electron control layer may be formed in common ona plurality of pixels (see PX of FIG. 6A).

An encapsulation layer TFE may be disposed on a light-emitting elementlayer DP-EL. The encapsulation layer TFE may include an inorganic layerTFE1, an organic layer TFE2, and an inorganic layer TFE3 that aresequentially stacked, but no limitation is imposed on layers included inthe encapsulation layer TFE.

The inorganic layers TFE1 and TFE3 may protect the light-emittingelement layer DP-EL against moisture and/or oxygen, and the organiclayer TFE2 may protect the light-emitting element layer DP-EL againstforeign substances such as dust particles. The inorganic layers TFE1 andTFE3 may include a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.The organic layer TFE2 may include an acryl-based organic layer, but theinvention is not limited thereto.

The input sensor IS may be disposed on the display panel DP. The inputsensor IS may be called a sensor, an input sensing layer, or an inputsensing panel. The input sensor IS may include a sensor base layer 210,a first conductive layer 220, a sensing dielectric layer 230, and asecond conductive layer 240.

The sensor base layer 210 may be directly disposed on the display panelDP. The sensor base layer 210 may be an inorganic layer that includes atleast one selected from silicon nitride, silicon oxynitride, and siliconoxide. Alternatively, the sensor base layer 210 may be an organic layerthat includes an epoxy-based resin, an acryl-based resin, or animide-based resin. The sensor base layer 210 may have a single-layeredstructure or a multi-layered structure in which layers are stacked alongthe third direction DR3.

Each of the first and second conductive layers 220 and 240 may have asingle-layered structure or a multi-layered structure in which layersare stacked along the third direction DR3. The first and secondconductive layers 220 and 240 may include conductive lines that define amesh-type sensing electrode. The conductive lines may not overlap theopening PDL-OP and may overlap the pixel definition layer PDL.

The single-layered conductive layer may include a metal layer or atransparent conductive layer. The metal layer may include molybdenum,silver, titanium, copper, aluminum, or an alloy thereof. The transparentconductive layer may include transparent conductive oxide, such as ITO,IZO, zinc oxide (ZnO), or IZTO. Alternatively, the transparentconductive layer may include a metal nano-wire, a graphene, or aconductive polymer such as PEDOT.

The multi-layered conductive layer may include metal layers that aresequentially stacked. The metal layers may include, for example,tri-layered structure of titanium/aluminum/titanium. The multi-layeredconductive layer may include at least one metal layer and at least onetransparent conductive layer.

The sensing dielectric layer 230 may be disposed between the firstconductive layer 220 and the second conductive layer 240. The sensingdielectric layer 230 may include an inorganic layer. The inorganic layermay include at least one selected from aluminum oxide, titanium oxide,silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, andhafnium oxide.

Alternatively, the sensing dielectric layer 230 may include an organiclayer. The organic layer may include at least one selected from anacryl-based resin, methacryl-based resin, polyisoprene, a vinyl-basedresin, an epoxy-based resin, a urethane-based resin, a cellulose-basedresin, a siloxane-based resin, a polyimide-based resin, apolyamide-based resin, and a perylene-based resin.

The antireflection layer LF may be disposed on the input sensor IS. Theantireflection layer LF may include a partition layer 310, a pluralityof color filters 320, and a planarization layer 330.

A material included in the partition layer 310 is not particularlylimited as long as the material absorbs light. The partition layer 310may be a black colored layer, and in an embodiment, the partition layer310 may include a black coloring agent. The black coloring agent mayinclude a black dye or a black pigment. The black coloring agent mayinclude one of carbon blacks, metals such as chromium, and oxidesthereof.

The partition layer 310 may cover the second conductive layer 240 of theinput sensor IS. The partition layer 310 may prevent external light frombeing reflected by the second conductive layer 240. In an embodiment, aportion of the partition layer 310 on the display module DM may beomitted. A zone from which the partition layer 310 is omitted may have atransmittance greater than that of other zones.

An opening 310-OP may be defined in the partition layer 310. The opening310-OP may overlap the first electrode AE of the light-emitting elementLD. One of a plurality of color filters 320 may overlap the firstelectrode AE of the light-emitting element LD. The one of a plurality ofcolor filters 320 may cover the opening 310-OP. Each of a plurality ofcolor filters 320 may be in contact with the partition layer 310.

The planarization layer LF may cover the partition layer 310 and aplurality of color filters 320. The planarization layer 330 may includean organic material and may have a planarized top surface. In anembodiment of the invention, the planarization layer 330 may be omitted.

FIG. 6A illustrates a plan view showing the display panel DP accordingto an embodiment of the invention. FIG. 6B illustrates an enlarged planview partially showing the display panel DP according to an embodimentof the invention. FIG. 6C illustrates an enlarged plan view partiallyshowing the display panel DP according to an embodiment of theinvention.

Referring to FIG. 6A, in an embodiment, the display panel DP may includethe display region DP-DA and the non-display region DP-NDA. The displayregion DP-DA and the non-display region DP-NDA may be divided or definedbased on the presence or absence of a pixel PX. The pixel PX may bedisposed on the display region DP-DA. A scan driver SDV, a data driver,and an emission driver EDV may be disposed on the non-display regionNDA. The data driver may be a portion of circuits configured on thedriver chip DIC.

In an embodiment, the signal transmission region DP-TA may be a zonewhose resolution is less than that of the display region DP-DA. In anembodiment, for example, the number of pixels per unit area may be lessin the signal transmission region DP-TA than in the display regionDP-DA. An optical signal may be transmitted through a portion of thesignal transmission region DP-TA, which is a portion where no pixel isprovided.

The display panel DP includes a first area AA1, a second area AA2, and abending area BA that are divided from each other in the second directionDR2. The second area AA2 and the bending area BA may be a portion of thenon-display region DP-NDA. The bending area BA may be disposed betweenthe first area AA1 and the second area AA2.

The first area AA1 is a zone that corresponds to the display surface DSshown in FIG. 1A. The first area AA1 may include a first non-foldingregion NFA10, a second non-folding region NFA20, and a folding regionFAO. The first non-folding region NFA10, the second non-folding regionNFA20, and the folding region FAO may respectively correspond to thefirst non-folding region NFA1, the second non-folding region NFA2, andthe folding region FA of FIG. 1C.

The bending area BA and the second area AA2 may each have a length inthe first direction DR1 less than a length in the first direction DR1 ofthe first area AA1. As the bending area BA has a smaller length in thefirst direction DR1 than the first area AA1, the bending area BA may bemore effectively bendable.

The display panel DP may include a plurality of pixels PX, a pluralityof scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, aplurality of emission lines EL1 to ELm, first and second control linesCSL1 and CSL2, a power line PL, and a plurality of pads PD. Herein, “m”and “n” are natural numbers. The pixels PX may be connected to the scanlines SL1 to SLm, the data lines DL1 to DLn, and the emission lines EL1to ELm.

The scan lines SL1 to SLm may extend in the second direction DR2 and beconnected to the scan driver SDV. The data lines DL1 to DLn may extendin the second direction DR2 and be connected to the data driver DDVthrough the bending area BA. The emission lines EL1 to ELm may extend inthe first direction DR1 and be connected to the emission driver EDV.

The power line PL may include a segment that extends in the seconddirection DR2 and a segment that extends in the first direction DR1. Theextending segment in the first direction DR1 may be located at adifferent level from that of the extending segment in the seconddirection DR2. The extending segment in the second direction DR2 of thepower line PL may extend through the bending area BA toward the secondarea AA2. The power line PL may provide the pixels PX with a firstvoltage.

The first control line CSL1 may be connected to the scan driver SDV, andmay extend through the bending area BA toward a bottom end of the secondarea AA2. The second control line CSL2 may be connected to the emissiondriver EDV, and may extend through the bending area BA toward the bottomend of the second area AA2.

When viewed in a plan view, the pads PD may be disposed adjacent to thebottom end of the second area AA2. The driver chip DIC, the power linePL, the first control line CSL1, and the second control line CSL2 may beconnected to the pads PD. The integrated circuit board PCB may beelectrically connected through an anisotropic conductive adhesion layerto the pads PD.

FIG. 6B shows a plan view showing some of the pixels PX illustrated inFIG. 6A, that is, the pixels PX that are adjacent to the signaltransmission region DP-TA. FIG. 6C shows an enlarged view partiallyshowing the pixels in FIG. 6B.

Referring to FIGS. 6A and 6B, in an embodiment, the pixels PX mayinclude a plurality of first pixels PX1 and a plurality of second pixelsPX2. The first pixels PX1 may be disposed on a first display region DA1.The second pixels PX2 may be disposed on a second display region DA2.The first display region DA1 may be a zone that corresponds to thesignal transmission region DP-TA. The display region DP-DA may have thesecond display region DA2 at a zone other than the signal transmissionregion DP-TA.

The first pixels PX1 may be arranged in a matrix shape on the firstdisplay region DA1. In an embodiment, for example, the first pixels PX1may be arranged in the first direction DR1 and the second direction DR2.However, the arrangement of the first pixels PX1 is not particularlylimited.

The second pixels PX2 may be arranged in a matrix shape on the seconddisplay region DA2. In an embodiment, for example, the second pixels PX2may be arranged in the first direction DR1 and the second direction DR2.However, the arrangement of the second pixels PX2 is not particularlylimited. In an embodiment, for example, the second pixels PX2 may bedisposed in a first diagonal direction DDR1 and a second diagonaldirection DDR2. The first diagonal direction DDR1 may be defined toindicate a direction that intersect the first and second directions DR1and DR2 on a plane formed by the first and second directions DR1 andDR2. The second diagonal direction DDR2 may be defined to indicate adirection that intersects the first diagonal direction DDR1 on a planeformed by the first and second directions DR1 and DR2. In an embodiment,for example, the first and second directions DR1 and DR2 mayorthogonally intersect each other, and the first and second diagonaldirections DDR1 and DDR2 may orthogonally intersect each other.

The first display region DA1 may display an image through the firstpixels PX1. The first display region DA1 may display an image throughthe second pixels PX2. In an embodiment, light generated from the firstpixels PX1 and the second pixels PX2 may allow the display region DP-DAto display an image. When viewed in a plan view, the second pixels PX2may have their shapes different from those of the first pixels PX1.

The display panel DP may include a plurality of transmission areas HA.The transmission areas HA may be disposed between the first pixels PX1.In an embodiment, for example, the transmission areas HA may each have across shape, but no limitation is imposed on the shape of thetransmission areas HA. The transmission areas HA may be disposed aroundcorresponding first pixels PX1. The transmission areas HA may be locatedin the first and second diagonal directions DDR1 and DDR2 aroundcorresponding first pixels PX1.

In an embodiment, for example, the first pixels PX1 may have atetragonal shape with sides parallel to the first direction DR1 andsides parallel to the second direction DR2. The transmission areas HAmay be disposed adjacent to vertices of corresponding first pixels PX1,and thus may be located in the first and second diagonal directions DDR1and DDR2 around corresponding first pixels PX1. However, the arrangementof the transmission areas HA is not particularly limited.

The transmission areas HA may have an optical transmittance greater thanthose of the first and second pixels PX1 and PX2. The electronic module(see ELM of FIG. 2 ) disposed below the first display region DA1 may beprovided with light that passes through the transmission areas HA.

An image may be displayed by the first pixels PX1 on the first displayregion DA1, and an optical signal may be provided through thetransmission areas HA to the electronic module ELM. Therefore, while thefirst display region DA1 displays an image, the electronic module ELM towhich an optical signal is provided may operate as a specific function.

Referring to FIG. 6C, the first pixel PX1 may include a plurality ofemission areas PA1_1, PA1_2, and PA1_3 that display a plurality ofcolors. The emission areas PA1_1, PA1_2, and PA1_3 may include aplurality of first emission areas PA1_1, a plurality of second emissionareas PA2_1, and a plurality of third emission areas PA3_1.

In an embodiment, for example, the first pixel PX1 may include two firstemission areas PA1_1, four second emission areas PA2_1, and two thirdemission areas PA3_1. However, the number of the first, second, andthird emission areas PA1_1, PA2_1, and PA3_1 disposed on the first pixelPX1 is not particularly limited.

In an embodiment, for example, the first emission areas PA1_1 mayexhibit red colors, the second emission areas PA2_1 may exhibit greencolors, and the third emission areas PA3_1 may exhibit blue colors.However, the colors exhibited from the first, second, and third emissionareas PA1_1, PA2_1, and PA3_1 are not particularly limited.

The first, second, and third emission areas PA1_1, PA2_1, and PA3_1 mayeach have a rectangular shape, but the shape of the first, second, andthird emission areas PA1_1, PA2_1, and PA3_1 is not particularlylimited.

In an embodiment, the first, second, and third emission areas PA1_1,PA2_1, and PA3_1 may be divided or separated from each other by thepixel definition layer PDL. In an embodiment, the pixel definition layerPDL may not be disposed on the transmission area HA.

In an embodiment, as shown in FIG. 6C, the first emission areas PA1_1and the third emission areas PA3_1 may extend in the first directionDR1. A pair of first and third emission areas PA1_1 and PA3_1 may bearranged in a way such that the third emission area PA3_1 is disposedabove the first emission area PA1_1 a plan view. Another pair of firstand third emission areas PA1_1 and PA3_1 may be arranged in a way suchthat the first emission area PA1_1 is disposed above the third emissionarea PA3_1 in a plan view. The pair of first and third emission areasPA1_1 and PA3_1 may be spaced apart in the second direction DR2 from theanother pair of first and third emission areas PA1_1 and PA3_1.

The second emission areas PA2_1 may extend in the second direction DR2,and may be arranged in the first direction DR1. The second emissionareas PA2_1 may be disposed between the pair of first and third emissionareas PA1_1 and PA3_1 and the another pair of first and third emissionareas PA1_1 and PA3_1.

FIG. 7A illustrates a cross-sectional view showing the display device DDaccording to an embodiment of the invention. FIG. 7B illustrates across-sectional view showing the display device DD according to anembodiment of the invention. FIGS. 7C and 7D illustrate cross-sectionalviews partially showing the display device DD according to an embodimentof the invention. FIG. 7A shows a cross-section that corresponds to thattaken along line II-IF of FIG. 6A. FIG. 7B shows a cross-sectional viewpartially showing a bent state of the bending area BA shown in FIG. 7A.FIG. 7A shows a state where the display panel DP of FIG. 7A is unfoldedbefore being bent, and installed on the electronic device ED. In anembodiment, as illustrated in FIG. 7B, the first area AA1 and the secondarea AA2 of the display panel DP may be located at different imaginaryplanes even in a state where the electronic device ED is unfolded asshown in FIG. 1A. A bent shape of the bending area BA will be describedbelow with reference to FIG. 7B. FIG. 7C shows a cross-section thatcorresponds to that taken along line of FIG. 6A. FIG. 7D shows across-section that corresponds to that taken along line IV-IV′ of FIG.6A.

Referring to FIGS. 7A and 7B, an embodiment of the display device DD mayinclude the window module WM and the display module DM.

The window module WM may include an ultra thin glass substrate UTG, awindow protection layer PF disposed on the ultra thin glass substrateUTG, and a bezel pattern BP disposed on a bottom surface of the windowprotection layer PF. In an embodiment, the window protection layer PFmay include a plastic film. The window module WM may further include anadhesion layer AL1 (referred to hereinafter as a first adhesion layer)that attaches the window protection layer PF to the ultra thin glasssubstrate UTG.

The bezel pattern BP may overlap the non-display region DP-NDAillustrated in FIG. 2 . The bezel pattern BP may be disposed on eitherone surface of the ultra thin glass substrate UTG or one surface of thewindow protection layer PF. FIG. 7A shows an embodiment where the bezelpattern BP is disposed on the bottom surface of the window protectionlayer PF. The invention, however, is not limited thereto, andalternatively, the bezel pattern BP may be disposed on a top surface ofthe window protection layer PF. The bezel pattern BP may a coloredlight-shield layer formed by coating, for example. The bezel pattern BPmay include a base material and a dye or pigment mixed in the basematerial. The bezel pattern BP may have a closed line shape when viewedin a plan view.

In an embodiment, when viewed in a plan view, the ultra thin glasssubstrate UTG may have an edge (see UTG-E of FIG. 7C) that does notoverlap the bezel pattern BP. In such an embodiment, the edge UTG-E ofthe ultra thin glass substrate UTG is exposed from the bezel pattern BP,and an inspection apparatus may inspect fine cracks that occur at theedge UTG-E of the ultra thin glass substrate UTG. The inspectionapparatus may include a microscope. When, on the top surface of thewindow protection layer PF, the inspection apparatus is used to capturethe edge UTG-E of the ultra thin glass substrate UTG, it may be possibleto identify the crack that begins from the edge UTG-E of the ultra thinglass substrate UTG. The invention, however, is not limited thereto, andalternatively, the bezel pattern BP may overlap the edge UTG-E of theultra thin glass substrate UTG.

The ultra thin glass substrate UTG may have a thickness in a range ofabout 15 micrometers (μm) to about 45 μm. The ultra thin glass substrateUTG may be a chemically strengthened glass. Even when the ultra thinglass substrate UTG performs repeated folding and unfolding operations,the occurrence of wrinkles in the ultra thin glass substrate UTG may beminimized or prevented.

The window protection layer PF may have a thickness in a range of about50 μm to about 80 μm. The window protection layer PF may includepolyimide, polycarbonate, polyamide, triacetylcellulose,polymethylmethacrylate, or polyethylene terephthalate. Although notshown, at least one selected from a hard coating layer, ananti-fingerprint layer, and an antireflection layer may be furtherprovided on a top surface of the window protection layer PF.

The first adhesion layer AL1 may be a pressure sensitive adhesive film(“PSA”) or an optically clear adhesive (“OCA”). The adhesion layers tobe described hereinbelow may also be identical to the first adhesionlayer AL1 and may include an ordinary or conventional adhesive.

The first adhesion layer AL1 may be separated from the ultra thin glasssubstrate UTG. The window protection layer PF may have strength lessthan that of the ultra thin glass substrate UTG, and thus scratches maybe relatively easily produced on the window protection layer PF. Afterthe separation of the first adhesion layer AL1 and the protection filmPF, a window protection layer PF may be newly attached to the ultra thinglass substrate UTG.

Although not shown, the window protection layer PF may include a plasticresin layer that is disposed directly on a top surface of the ultra thinglass substrate UTG. An insert molding method may be used to form theplastic resin layer in contact with the top surface of the ultra thinglass substrate UTG. Before the plastic resin layer is formed, the bezelpattern BP may be formed on the top surface of the ultra thin glasssubstrate UTG. Then, the plastic resin layer may be formed to cover thebezel pattern BP.

Although not shown, a hard coating layer may be disposed on the windowprotection layer PF. The hard coating layer may be a functional layerthat is disposed on an uppermost outer surface of the display device DDand increases usage of the display device DD. In an embodiment, forexample, the hard coating layer may improve anti-fingerprint properties,pollution-free properties, and/or anti-scratch properties.

The display module DM includes an impact resistance layer DMP, a displaypanel DP, a panel protection layer PPL, a barrier layer BRL, and a lowermember LM. The lower member LM may include a support layer PLT, a coverlayer SCV, a digitizer DTM, an electromagnetic shield layer EMS, a lowermetal plate MP, a thermal radiation layer HRP, and an electromagneticshield sheet MSM. The display module DM may include second to eighthadhesion layers AL2 to AL8. The second to eighth adhesion layers AL2 toAL8 may include an adhesive, such as a PSA or an OCA. In an embodimentof the invention, one or more of the components discussed above may beomitted. In an embodiment, for example, the lower metal plate MP and theeighth adhesion layer AL8 related thereto may be omitted. In anembodiment, for example, the thermal radiation layer HRP and theelectromagnetic shield sheet MSM may be omitted. Although only thedisplay panel DP is illustrated in FIG. 7A, the input sensor IS and theantireflection layer LF may be further disposed on the display panel DPas shown in FIG. 4 .

The impact resistance layer DMP may be disposed on the display panel DP,and may operate a function that protects the display panel DP againstexternal impact. The impact resistance layer DMP may allow the displaypanel DP to have increased properties of impact resistance and mayprevent the display panel DP from downwardly sinking caused by a hole ofthe lower member LM, which hole is formed corresponding to the signaltransmission region (see DP-TA of FIG. 6A) of the display panel DP. Thesecond adhesion layer AL2 attaches the impact resistance layer DMP tothe window module WM, and the third adhesion layer AL3 attaches theimpact resistance layer DMP to the display panel DP.

Referring to FIGS. 7C and 7D, when viewed in a plan view, the edge UTG-Eof the ultra thin glass substrate UTG may be disposed inwardly more thanan edge PF-E of the window protection layer PF. In an embodiment, forexample, compared to the edge PF-E of the window protection layer PF,the edge UTG-E of the ultra thin glass substrate UTG may be placedadjacent to (or disposed inwardly toward) the display region (see DP-DAof FIG. 6A). The folding operation of the display device DD may induce avariation in positional relationship between layers included in thedisplay device DD, but according to an embodiment of the invention, theedge UTG-E of the ultra thin glass substrate UTG may be disposed moreinwardly than the edge PF-E of the window protection layer PF, and thuseven when there is a variation in positional relationship between layersincluded in the display device DD, it may be less likely that the edgeUTG-E of the ultra thin glass substrate UTG protrudes more outwardlythan the edge PF-E of the window protection layer PF. Accordingly, itmay be less likely that that external impact propagates through the edgeUTG-E of the ultra thin glass substrate UTG. As a result, there may be areduction in possibility of occurrence of crack at the ultra thin glasssubstrate UTG. A first distance d1 between the edge UTG-E of the ultrathin glass substrate UTG and the edge PF-E of the window protectionlayer PF may be in a range of about 180 μm to about 250 μm, for example,about 210 μm.

Referring to FIGS. 6A and 7C, on a cross-section that corresponds to thenon-folding region NFA20, the second adhesion layer AL2 may have an edgeAL2-E that is disposed more inwardly than the edge UTG-E of the ultrathin glass substrate UTG. In an embodiment, for example, compared to theedge UTG-E of the ultra thin glass substrate UTG, the edge AL2-E of thesecond adhesion layer AL2 may be disposed adjacent to the display regionDP-DA. According to an embodiment of the invention, as the edge AL2-E ofthe second adhesion layer AL2 is disposed more inwardly than the edgeUTG-E of the ultra thin glass substrate UTG, it may be possible toprevent the ultra thin glass substrate UTG from suffering from bucklingissues during the folding operation of the display device DD. A seconddistance d2 between the edge AL2-E of the second adhesion layer AL2 andthe edge UTG-E of the ultra thin glass substrate UTG may be in a rangeof about 170 μm to about 230 μm, for example, about 190 μm.

Referring to FIGS. 6A and 7D, on a cross-section that corresponds to thefolding region FAO, the second adhesion layer AL2 may have an edge AL2-Ethat is substantially aligned with the edge UTG-E of the ultra thinglass substrate UTG. In an embodiment, for example, unlike thenon-folding region NFA20, the edge AL2-E of the second adhesion layerAL2 may not be disposed more inwardly than the edge UTG-E of the ultrathin glass substrate UTG, but may be disposed at substantially a sameposition as (or aligned with) that of the edge UTG-E of the ultra thinglass substrate UTG. Herein, the expression “substantially the same” interms of thickness, width, interval, or the like may include “physicallycompletely same”, and may also include “the same by design and slightdifference due to errors possibly occurring during process.” Accordingto an embodiment of the invention, on the non-folding regions NFA10 andNFA20 other than the folding region FAO, the buckling issues may beeffectively prevented because the edge UTG-E of the ultra thin glasssubstrate UTG is disposed more inwardly than the edge AL2-E of thesecond adhesion layer AL2, but on the folding region FAO, the secondadhesion layer AL2 may be designed to have its edge AL2-E aligned withthe edge UTG-E of the ultra thin glass substrate UTG, and thus it may bepossible to increase an adhesive force between the ultra thin glasssubstrate UTG and the impact resistance layer DMP on the folding regionFAO and to prevent delamination caused by adhesion reduction, resultingfrom repeated folding operations, of the second adhesion layer AL2 thatattaches the ultra thin glass substrate UTG and the impact resistancelayer DMP.

Referring back to FIGS. 7A and 7B, the panel protection layer PPL may bedisposed below the display panel DP. The panel protection layer PPL mayprotect a lower portion of the display panel DP. The panel protectionlayer PPL may include a flexible plastic material. In an embodiment, forexample, the panel protection layer PPL may include polyethyleneterephthalate (“PET”). In an embodiment of the invention, the panelprotection layer PPL may not be disposed on the folding region FAO. Thepanel protection layer PPL may include a first panel protection layerPPL-1 that protects the first area AA1 of the display panel DP and asecond panel protection layer PPL-2 that protects the second area AA2 ofthe display panel DP.

The fourth adhesion layer AL4 attaches the panel protection layer PPL tothe display panel DP. The fourth adhesion layer AL4 may include a firstpart AL4-1 that corresponds to the first panel protection layer PPL-1and a second part AL4-2 that corresponds to the second panel protectionlayer PPL-2.

As illustrated in FIG. 7B, when the bending area BA is bent, the secondpanel protection layer PPL-2 together with the second area AA2 may bedisposed below the first area AA1 and the first panel protection layerPPL-1. In such an embodiment, the panel protection layer PPL is notdisposed on the bending area BA, such that the bending area BA may bemore easily bent.

The bending area BA may have a curvature and a radius of curvature. Theradius of curvature may be in a range from about 0.1 millimeter (mm) toabout 0.5 mm. A bending protection layer BPL may be disposed on at leastthe bending area BA. The bending protection layer BPL may overlap thebending area BA, the first area AA1, and the second area AA2. Thebending protection layer BPL may be placed on a portion of the firstarea AA1 and on a portion of the second area AA2.

The bending protection layer BPL may bend together with the bending areaBA. The bending protection layer BPL may protect the bending area BAagainst external impact and may control a neutral surface of the bendingarea BA. The bending protection layer BPL may control a stress of thebending area BA to allow signal lines on the bending area BA to becomeclose to the neutral surface.

In an embodiment, as illustrated in FIGS. 7A and 7B, the fifth adhesionlayer AL5 attaches the panel protection layer PPL to the barrier layerBRL. The barrier layer BTU, may be disposed below the panel protectionlayer PPL. The barrier layer BRL may increase resistance to acompressive force caused by external suppression. Therefore, the barrierlayer BRL may serve to prevent the display panel DP from being deformed.The barrier layer BRL may include a flexible plastic material, such aspolyimide or polyethylene terephthalate. In an embodiment, the barrierlayer BRL may be a colored film whose optical transmittance is low. Thebarrier layer BRL may absorb externally incident light. In anembodiment, for example, the barrier layer BRL may be a black plasticfilm. When the display module DM is viewed from a top side of the windowmodule WM, components disposed below the barrier layer BRL may beinvisible to users.

The sixth adhesion layer AL6 attaches the barrier layer BRL to thesupport layer PLT. The sixth adhesion layer AL6 may include a firstadhesion part AL6-1 and a second adhesion part AL6-2. An interval W3, ordistance, between the first adhesion part AL6-1 and the second adhesionpart AL6-2 corresponds to a width of the folding region FAO and isgreater than a gap between first and second digitizers DTM-1 and DTM-2of the digitizer DTM which will be discussed below. The interval W3between the first adhesion part AL6-1 and the second adhesion part AL6-2may be in a range from about 7 mm to about 15 mm, for example, fromabout 9 mm to about 12 mm. In one embodiment, for example, the intervalW3 between the first adhesion part AL6-1 and the second adhesion partAL6-2 may be about 9.65 mm.

In an embodiment, the first adhesion part AL6-1 and the second adhesionpart AL6-2 are defined to indicate different segments of one adhesionlayer, but the invention is not limited thereto. In an embodiment, thefirst adhesion part AL6-1 is defined as one adhesion layer (or firstadhesion layer), and the second adhesion part AL6-2 may be defined asanother adhesion layer (or second adhesion layer).

The support layer PLT is disposed below the barrier layer BRL. Thesupport layer PLT supports components disposed thereon and maintains anunfolding or folding state of the display device DD. The support layerPLT includes a first support part PLT-1 that corresponds to the firstnon-folding region NFA10 and a second support part PLT-2 thatcorresponds to the second non-folding region NFA20. The first supportpart PLT-1 and the second support part PLT-2 are spaced apart from eachother in the second direction DR2.

In an embodiment, the support layer PLT may further include a foldingpart PLT-F which corresponds to the folding region FAO, which isdisposed between the first support part PLT-1 and the second supportpart PLT-2, and in which a plurality of openings OP are defined. As theplurality of openings OP are defined in the folding part PLT-F, it maybe possible to reduce stress applied to the support layer PLT during thefolding operation illustrated in FIG. 1B or 1C. The plurality ofopenings OP defined in the folding part PLT-F may be provided in aplurality of rows that are arranged offset from each other.

The support layer PLT may be selected from a material that allows anelectromagnetic field generated from the digitizer DTM to passtherethrough with no or minimum loss. The support layer PLT may includea nonmetallic material. The support layer PLT may include plastic, fiberreinforced plastic, or glass. The support layer PLT may include, forexample, carbon fiber reinforced plastic (“CFRP”). The first supportpart PLT-1, the second support part PLT-2, and the folding part PLT-Fincluded in the support layer PLT may include a same material as eachother. The first support part PLT-1, the second support part PLT-2, andthe folding part PLT-F may constitute or integrally formed as a singleunitary unit.

The support layer PLT may have a plurality of openings OP defined in itspartial region that corresponds to the folding region FAO. The pluralityof openings OP may be defined in the folding part PLT-F of the supportlayer PLT. The openings OP may increase flexibility of the support layerPLT. The sixth adhesion layer AL6 may be absent on a region thatcorresponds to the folding region FAO, and thus the support layer PLTmay increase in flexibility.

The seventh adhesion layer AL7 and the cover layer SCV are disposedbelow the support layer PLT. Herein, the seventh adhesion layer AL7 maybe referred to as a lower adhesion layer.

The cover layer SCV may have a sheet shape and may be attached to thesupport layer PLT. The cover layer SCV may have an elastic modulus lessthan that of the support layer PLT. In an embodiment, for example, thecover layer SCV may include at least one selected from thermoplasticpolyurethane (“TPU”), rubber, and silicon. Although not shown, the coverlayer SCV may be attached below the support layer PLT through anadditional adhesion layer.

The lower adhesion layer AL7 may be disposed below the support layerPLT, and may attach the support layer PLT to the digitizer DTM. Thelower adhesion layer AL7 may include a first lower adhesion layer AL7-1disposed below the first support part PLT-1 and a second lower adhesionlayer AL7-2 disposed below the second support part PLT-2.

The digitizer DTM, which is also referred to as an electromagneticresonance (“EMR”), includes a plurality of coil loops that generate anelectromagnetic wave at a preset resonance frequency with an electronicpen. The electromagnetic wave generated from the coil is applied to anLC resonance circuit that is constituted by a capacitor and an inductor(or coil) of the electronic pen. The coil generates a current from thereceived electromagnetic wave and transmits the generated current to thecapacitor. Therefore, the capacitor charges the current that is inputfrom the coil and discharges the charged current to the coil. The coilelectromagnetic wave eventually releases the electromagnetic wave at theresonance frequency. The loop coil of the digitizer DTM may re-absorbthe electromagnetic wave released from the electronic pen, and thereforeit may be possible to determine a position where the electronic pen isclose to a touch screen.

The digitizer DTM may include a first digitizer DTM-1 attached below thefirst lower adhesion layer AL7-1 and a second digitizer DTM-2 attachedbelow the second lower adhesion layer AL7-2. The first digitizer DTM-1and the second digitizer DTM-2 may be disposed spaced apart from eachother with a gap therebetween. The gap may be in a range from about 0.3mm to about 3 mm. In an embodiment, for example, the gap may be in arange from about 0.4 mm to about 2 mm. The gap may be defined tocorrespond to the folding region FAO. The digitizer DTM will bediscussed in detail below.

The electromagnetic shield layer EMS may be disposed below the digitizerDTM. The electromagnetic shield layer EMS may be provided to block thedigitizer DTM from being affected by electromagnetic waves or noisegenerated from the electronic module ELM and the control module EM thatare illustrated in FIG. 2 . The electromagnetic shield layer EMS mayinclude a first electromagnetic shield layer EMS1 and a secondelectromagnetic shield layer EMS2 that respectively correspond to thefirst digitizer DTM-1 and the second digitizer DTM-2. In an embodiment,the electromagnetic shield layer EMS may be a copper sheet. Theelectromagnetic shield layer EMS may include a magnetic metal powder(“MMP”). A coating process and a curing process may be employed suchthat the magnetic metal power may be formed directly on a bottom surfaceof the digitizer DTM. In an alternative embodiment of the invention, theelectromagnetic shield layer EMS may be omitted.

The eighth adhesion layer AL8 attaches the electronic shield layer EMSto the lower metal plate MP. The eighth adhesion layer AL8 may include afirst part AL8-1 and a second part AL8-2 that are spaced apart from eachother. The lower metal plate MP may include a first lower metal plateMP1 and a second lower metal plate MP2 that are respectively attached tothe first part AL8-1 and the second part AL8-2. The lower metal plate MPmay increase thermal radiation properties, and may protect an upperportion of the lower metal plate MP against an external pressuregenerated in an attachment process when the second panel protectionlayer PPL-2 is fixed after being bent as illustrated in FIG. 7B.

The thermal radiation layer HRP may be disposed below the lower metalplate MP. The thermal radiation layer HRP may be a sheet whose thermalconductivity is high. The thermal radiation layer HRP may include ametal or any alloy thereof, such as copper, copper alloy, or graphite.

The thermal radiation layer HRP may include a first thermal radiationlayer HRP1 and a second thermal radiation layer HRP2. The first thermalradiation layer HRP1 and the second thermal radiation layer HRP2 may bespaced apart from each other with a certain interval. An intervalbetween the first thermal radiation layer HRP1 and the second thermalradiation layer HRP2 may be in a range from about 0.4 mm to about 2 mm,but the invention is not limited thereto. The first thermal radiationlayer HRP1 and the second thermal radiation layer HRP2 may be disposedto have an interval that corresponds to the folding region FAO.

The electromagnetic shield sheet MSM may be disposed below the digitizerDTM. The electromagnetic shield sheet MSM may include a plurality ofparts. At least one of the plurality of parts may have a thicknessdifferent from those of other parts. The plurality of parts of theelectromagnetic shield sheet MSM may be disposed to correspond to a stepdifference of a bracket (not shown) disposed below the display deviceDD. The electromagnetic shield sheet MSM may be disposed below thedigitizer DTM and located at a position where the electromagnetic shieldlayer EMS is not disposed. In an embodiment, the electromagnetic shieldsheet MSM may be disposed below the lower metal plate MP and located ata position where the thermal radiation layer HRP is disposed. Theelectromagnetic shield sheet MSM may have a structure in which at leastone electromagnetic shield layer and at least one adhesion layer arestacked alternately one on another. The electromagnetic shield sheet MSMshields an electromagnetic wave generated from a magnetic body (notshown) disposed thereunder. The electromagnetic shield sheet MSM mayprevent the digitizer DTM from interference caused by theelectromagnetic wave generated from the magnetic body. Although notshown, a printed circuit board (“PCB”) may be disposed on theelectromagnetic shield sheet MSM.

Although not shown, a through hole may be defined or formed in somecomponents of the lower member LM. The through hole may overlap thesignal transmission region DP-TA of FIG. 2 . In an embodiment, forexample, the through hole may be defined through layers from the fifthadhesion layer AL5 to the lower metal plate MP. The formation of thethrough hole may allow an optical signal path to be free of a structurethat blocks an optical signal. The through hole may increase a receptionefficiency of optical signals of the electronic module (see EM of FIG. 2).

FIG. 8 illustrates a cross-sectional view the lower member LM accordingto an embodiment of the invention. FIG. 8 shows the support layer PLT,the cover layer SCV, the lower adhesion layer AL7, and the digitizer DTMof the lower member LM shown in FIG. 7A, but the electromagnetic shiedlayer EMS, the lower metal plate MP, the thermal radiation layer HRP,and the electromagnetic shield sheet MSM of the lower member LM shown inFIG. 7A are omitted for convenience of illustration.

Referring to FIG. 8 , the support layer PLT includes the first supportpart PLT-1, the folding part PLT-F, and the second support part PLT-2that are sequentially arranged. A plurality of openings OP are definedin the folding part PLT-F.

The cover layer SCV may have a sheet shape and may be attached to thesupport layer PLT. The cover layer SCV may be attached below the foldingpart PLT-F of the support layer PLT. The cover layer SCV may be attachedbelow the folding part PLT-F, and may block introduction of moisture andforeign substances into the plurality of openings OP defined in thefolding part PLT-F. The cover layer SCV may include a material whoseelastic modulus is low, for example, thermoplastic polyurethane. Thecover layer SCV may be attached below the folding part PLT-F of thesupport layer PLT, and may not be disposed below most of the firstsupport part PLT-1 and the second support part PLT-2.

The lower adhesion layer AL7 may be disposed below the support layer PLTand may attach the support layer PLT to the digitizer DTM. The loweradhesion layer AL7 may be in contact with a bottom surface of thesupport layer PLT and with a top surface of the digitizer DTM. In anembodiment, for example, for the support layer PLT and the digitizer DTMthat are attached to each other through the lower adhesion layer AL7,the support layer PLT and the digitizer DTM may have not therebetweenany component other than the lower adhesion layer AL7.

When viewed in a plan view, the lower adhesion layer AL7 may not overlapthe cover layer SCV. In an embodiment, for example, when viewed in athickness direction of the lower member LM, the lower adhesion layer AL7and the cover layer SCV may not overlap each other. The lower adhesionlayer AL7 may include the first lower adhesion layer AL7-1 disposedbelow the first support part PLT-1 and the second lower adhesion layerAL7-2 disposed below the second support part PLT-2. The first loweradhesion layer AL7-1 and the second lower adhesion layer AL7-2 may bedisposed spaced apart from each other, and the cover layer SCV may bedisposed on a location where the first lower adhesion layer AL7-1 andthe second lower adhesion layer AL7-2 are spaced apart from each other.

In such an embodiment where the lower adhesion layer AL7 does notoverlap the cover layer SCV and directly attaches the support layer PLTto the digitizer DTM, it may be possible to increase a thickness of thelower adhesion layer AL7. In an embodiment, the lower adhesion layer AL7may have a thickness h2 greater than a thickness h1 of the cover layerSCV. In an embodiment, the thickness h2 of the lower adhesion layer AL7may be in a range from about 15 μm to about 25 μm. In one embodiment,for example, the thickness h2 of the lower adhesion layer AL7 may beabout 20 μm. In an embodiment, the thickness h1 of the cover layer SCVmay be in a range from about 10 μm to about 20 μm. In one embodiment,for example, the thickness h1 of the cover layer SCV may be about 16 μm.In such an embodiment where the thickness h2 of the lower adhesion layerAL7 is greater than the thickness h1 of the cover layer SCV, the coverlayer SCV may be disposed spaced apart from the top surface of thedigitizer DTM. The cover layer SCV may be in contact with the bottomsurface of the support layer PLT and may not be in contact with the topsurface of the digitizer DTM.

A width in one direction of the cover layer SCV may be greater than awidth in the one direction of the folding part PLT-F. In an embodiment,when viewed in the second direction DR2 along which are arranged thefirst support part PLT-1, the folding part PLT-F, and the second supportpart PLT-2, the folding part PLT-F may have a first width W1 and thecover layer SCV may have a second width W2. The first width W1 may beless than the second width W2. In an embodiment, the first width W1 maybe less as much as (or by a distance in a range of) about 0.5 mm toabout 3 mm than the second width W2. In an embodiment, the first widthW1 may be in a range from about 6 mm to about 10 mm. In one embodiment,for example, the first width W1 may be about 8.65 mm. In an embodiment,the second width W2 may be in a range from about 9 mm to about 15 mm. Inone embodiment, for example, the second width W2 may be about 10.65 mm.

The interval W3 between the first adhesion part AL6-1 and the secondadhesion part AL6-2 of the sixth adhesion layer AL6 disposed on thesupport layer PLT may be greater than the first width W1 and less thanthe second width W2. In one embodiment, for example, the interval W3between the first adhesion part AL6-1 and the second adhesion part AL6-2may be about 9.65 mm.

In the lower member LM included in the display device DD according to anembodiment, the cover layer SCV disposed below the support layer PLT maybe disposed on a location that corresponds to the folding part PLT-F andmay not be disposed on a location below most of the first and secondsupport parts PLT-1 and PLT-2 other than the folding part PLT-F.Therefore, the lower adhesion layer AL7 disposed below the first andsecond support parts PLT-1 and PLT-2 may directly attach the supportlayer PLT and the digitizer DTM to each other with no componenttherebetween. Therefore, in an embodiment of the display device DD, thelower adhesion layer AL7 may have a relatively large thickness, comparedto a case where the cover layer SCV is disposed to overlap the firstsupport part PLT-1, the folding part PLT-F, and the second support partPLT-2 of the support layer PLT. Accordingly, it may be possible toincrease adhesive forces at interfaces among the lower adhesion layerAL7, the support layer PLT, and the digitizer DTM, and thus durabilityand water-proof properties of the display device DD may be improved.

FIG. 9A illustrates a plan view showing the digitizer DTM according toan embodiment of the invention. FIG. 9B illustrates a plan view showinga sensing area SA1 of the digitizer DTM according to an embodiment ofthe invention. FIG. 9C illustrates a plan view showing a sensing areaSA1 of the digitizer DTM according to an embodiment of the invention.FIG. 9D illustrates a cross-sectional view showing the lower adhesionlayer AL7 and a portion of the digitizer DTM according to an embodimentof the invention.

In an embodiment, as shown in FIG. 9A, the digitizer DTM may include thefirst digitizer DTM-1 and the second digitizer DTM-2 that are spacedapart from each other. The first digitizer DTM-1 and the seconddigitizer DTM-2 may be disposed spaced apart from each other with acertain gap GP therebetween. The gap GP may be in a range from about 0.3mm to about 3 mm. In an embodiment, for example, the gap GP may be in arange from about 0.4 mm to about 2 mm. The gap GP may be defined tocorrespond to the folding region (see FAO of FIG. 7A).

A first flexible circuit film FCB1 and a second flexible circuit filmFCB2 may be electrically connected to the first digitizer DTM-1 and thesecond digitizer DTM-2, respectively. The first flexible circuit filmFCB1 and the second flexible circuit film FCB2 may be connected to asame circuit board. In an embodiment, for example, the first flexiblecircuit film FCB1 and the second flexible circuit film FCB2 may beconnected to the printed circuit board PCB describe above with referenceto FIG. 2 or to a main circuit board connected to the printed circuitboard PCB. The first flexible circuit film FCB1 and the second flexiblecircuit film FCB2 may be replaced with a single circuit film.

The first digitizer DTM-1 and the second digitizer DTM-2 mayrespectively include a first sensing area SA1 and a second sensing areaSA2, and may also respectively include a first non-sensing area NSA1 anda second non-sensing area NSA2. The first non-sensing area NSA1 and thesecond non-sensing area NSA2 may be disposed adjacent to the firstsensing area SA1 and the second sensing area SA2, respectively. Thefirst digitizer DTM-1 and the second digitizer DTM-2 may have a sameconfiguration or structure as each other, and thus only the firstdigitizer DTM-1 will hereinafter be described in detail.

In an embodiment, as shown in FIG. 9B, the first sensing area SA1 mayinclude a plurality of first loop coils 510 (referred to hereinafter asfirst coils) and a plurality of second loop coils 520 (referred tohereinafter as second coils). The first coils 510 may be referred to asdriver coils, and the second coils 520 may be referred to as sensingcoils, or the invention is not limited thereto, and this configurationmay be arranged vice versa.

Each of the first coils 510 may be arranged along the first directionDR1 and may extend along the second direction DR2. The second coils 520may each extend along the first direction DR1, and may be arrangedspaced apart from each other in the second direction DR2. In anembodiment, differently from that shown in FIG. 9B, neighboring firstcoils 510 may be arranged to overlap each other. A bridge pattern may bedisposed at an intersection between the first coils 510. Neighboringsecond coils 520 may be arranged to overlap each other. A bridge patternmay be disposed at an intersection between the second coils 520.

An alternating current signal may be sequentially provided to firstterminals 510 t of the first coils 510. Other terminals different fromthe first terminals 510 t of the first coils 510 may be electricallygrounded. Signal lines may be connected to corresponding first terminals510 t of the first coils 510, but the signal lines are not shown in FIG.5B. The signal lines may be disposed on the first non-sensing area NSA1shown in FIG. 5A.

When current flows through the first coils 510, a magnetic line of forcemay be induced between the first coils 510 and the second coils 520. Thesecond coils 520 may detect an induced magnetic line of force dischargedfrom an electronic pen, and second terminals 520 t of the second coils520 may output the magnetic line of force as a detection signal. Otherterminals different from the second terminals 520 t of the second coils520 may be electrically grounded. Signal lines may be connected tocorresponding second terminals 520 t of the second coils 520, but thesignal lines are not shown in FIG. 5B. The signal lines may be disposedon the first non-sensing area NSA1 shown in FIG. 5A.

Referring to FIGS. 9A to 9C, the first digitizer DTM-1 includes a baselayer DTM-BL, the first coils 510 disposed on one surface of the baselayer DTM-BL, and the second coils 520 disposed on other surface of thebase layer DTM-BL. The base layer DTM-BL may include a plastic film,such as a polyimide film. The first coils 510 and the second coils 520may include a metal, such as gold (Au), silver (Ag), copper (Cu), oraluminum (Al).

In an embodiment, protection layers that protect the first coils 510 andthe second coils 520 may be disposed on opposing surfaces of the baselayer DTM-BL. In an embodiment, the protection layers may include afirst protection layer PL-D1 that is disposed on the first coils 510 andis attached through a first adhesion layer AL-D1, and may also include asecond protection layer PL-D2 that is disposed on the second coils 520and is attached through a second adhesion layer AL-D2. Each of the firstand second protection layers PL-D1 and PL-D2 may include a plastic, suchas a polyimide film.

In an embodiment, as shown in FIG. 9C, the first digitizer DTM-1 mayhave undulation produced on each of top and bottom surfaces thereof bythe first coils 510 and the second coils 520. In an embodiment, thesupport layer (see PLT of FIG. 8 ) disposed on the digitizer (see DTM ofFIG. 8 ) may effectively prevent a user from recognizing the undulationproduced by the first coils 510 and the second coils 520. In anembodiment, for example, when viewed from top of the display device DD,the support layer PLT may prevent recognition of the first and secondcoils 510 and 520 disposed below the support layer PLT.

In an embodiment, where the support layer PLT includes a dielectricnon-metallic material as described above, a magnetic field may passthrough the support layer PLT. Accordingly, the digitizer DTM disposedbelow the support layer PLT may detect an external input. In a casewhere the support layer PLT includes a metallic material, the metallicmaterial included in the support layer PLT may interfere with themagnetic field generated from the digitizer DTM and thus the digitizerDTM may problematically decrease in sensibility.

Referring to FIGS. 8 and 9A to 9D, the lower adhesion layer AL7 disposedon the digitizer DTM may cover the undulation produced on the topsurface of the digitizer DTM. The lower adhesion layer AL7 may coverundulation produced on a top surface of each of the first digitizerDTM-1 and the second digitizer DTM-2. The first lower adhesion layerAL7-1 may cover the undulation produced on the top surface of the firstdigitizer DTM-1, and the second lower adhesion layer AL7-2 may cover theundulation produced on the top surface of the second digitizer DTM-2.The lower adhesion layer AL7 may cover undulation, which is produced bythe first coils 510, on the top surface of the first digitizer DTM-1.

In an embodiment of the display device DD, the lower adhesion layer AL7may directly attach the support layer PLT and the digitizer DTM to eachother with no component therebetween, and thus the lower adhesion layerAL7 may be designed to have a large thickness. Therefore, the loweradhesion layer AL7 may cover the undulation produced on the digitizerDTM, and the display device DD may be prevented from water-proofdegradation caused by line undulation of the digitizer DTM.

According to an embodiment of the invention, a cover layer that preventsintroduction of foreign substances may be attached only to a foldingpart, and a lower adhesion layer may directly attach a support plate anda digitizer to each other with no component therebetween, through thelower adhesion layer having a large thickness. Accordingly, it may bepossible to increase an adhesive force of the lower adhesion layer, tocover undulation produced by coils of the digitizer, and to improvedurability and water-proof properties of a display device.

The invention should not be construed as being limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete and will fully conveythe concept of the invention to those skilled in the art.

While the invention has been particularly shown and described withreference to embodiments thereof, it will be understood by those ofordinary skill in the art that various changes in form and details maybe made therein without departing from the spirit or scope of theinvention as defined by the following claims.

What is claimed is:
 1. A display device, comprising: a display panelwhich includes a first non-folding region, a second non-folding region,and a folding region between the first non-folding region and the secondnon-folding region; and a lower member below the display panel, whereinthe lower member includes: a support layer below the display panel,wherein the support layer includes a first support part which overlapsthe first non-folding region, a second support part which overlaps thesecond non-folding region, and a folding part which overlaps the foldingregion, wherein a plurality of openings is defined in the folding part;a digitizer below the support layer, wherein the digitizer correspondsto the first support part and the second support part; a cover layerbetween the support layer and the digitizer, wherein the cover layer isattached below the folding part; and a lower adhesion layer between thesupport layer and the digitizer, wherein the lower adhesion layer isbelow the first support part and the second support part.
 2. The displaydevice of claim 1, wherein a thickness of the lower adhesion layer isgreater than a thickness of the cover layer.
 3. The display device ofclaim 2, wherein the thickness of the lower adhesion layer is in a rangeof about 15 micrometers to about 25 micrometers, and the thickness ofthe cover layer is in a range of about 10 micrometers to about 20micrometers.
 4. The display device of claim 1, wherein the cover layerincludes at least one selected from thermoplastic polyurethane, rubber,and silicon.
 5. The display device of claim 1, wherein the first supportpart, the folding part, and the second support part are sequentiallyarranged along a first direction, wherein a first width in the firstdirection of the folding part is less by a distance in a range of about0.5 micrometers to about 3 micrometers than a second width in the firstdirection of the cover layer.
 6. The display device of claim 1, whereinthe digitizer includes: a first digitizer including a first sensing areawhich corresponds to the first support part; and a second digitizerincluding a second sensing area which corresponds to the second supportpart, wherein the second digitizer is spaced apart from the firstdigitizer.
 7. The display device of claim 6, wherein the lower adhesionlayer includes: a first lower adhesion layer in contact with a bottomsurface of the first support part and with a top surface of the firstdigitizer; and a second lower adhesion layer in contact with a bottomsurface of the second support part and with a top surface of the seconddigitizer.
 8. The display device of claim 1, wherein the digitizerincludes: a base layer; and a plurality of coils on a surface of thebase layer, wherein the lower adhesion layer covers an undulation on atop surface of the digitizer, and the undulation is defined by theplurality of coils.
 9. The display device of claim 1, wherein thesupport layer includes a non-metallic material.
 10. The display deviceof claim 1, wherein the cover layer is in contact with a bottom surfaceof the folding part and is spaced apart from the digitizer.
 11. Thedisplay device of claim 1, wherein the lower member further includes: anelectromagnetic shield layer below the digitizer; a lower metal platebelow the electromagnetic shield layer; and a thermal radiation layerbelow the lower metal plate.
 12. The display device of claim 1, furthercomprising: an input sensor directly on the display panel; and anantireflection layer directly on the input sensor.
 13. The displaydevice of claim 12, wherein the antireflection layer includes: aplurality of color filters; and a partition layer between the pluralityof color filters.
 14. The display device of claim 1, wherein the displaypanel includes: a display region which includes a first display regionand a second display region adjacent to the first display region; and aperipheral region adjacent to the display region, wherein the firstdisplay region has an optical transmittance relatively greater than anoptical transmittance of the second display region.
 15. The displaydevice of claim 1, wherein the lower member further includes: a barrierlayer below the display panel; a first adhesion part which attaches thebarrier layer and the first support part to each other; and a secondadhesion part which attaches the barrier layer and the second supportpart to each other, wherein the second adhesion part is spaced apartfrom the first adhesion part, wherein an interval between the firstadhesion part and the second adhesion part is greater than an intervalbetween the first support part and the second support part.
 16. Adisplay device, comprising; a display panel which includes a firstnon-folding region, a second non-folding region, and a folding regionbetween the first non-folding region and the second non-folding region;and a lower member below the display panel, wherein the lower memberincludes: a support layer below the display panel; a digitizer below thesupport layer; a lower adhesion layer in contact with a bottom surfaceof the support layer and with a top surface of the digitizer; and acover layer in contact with the bottom surface of the support layer,wherein the cover layer does not overlap the lower adhesion layer whenviewed in a plan view.
 17. The display device of claim 16, wherein thedigitizer includes: a base layer; and a plurality of coils on onesurface of the base layer, wherein the lower adhesion layer covers anundulation on the top surface of the digitizer, wherein the undulationis defined by the plurality of coils.
 18. An electronic device,comprising: a display device which includes a signal transmission regionthrough which an optical signal passes, a display region adjacent to thesignal transmission region, and a non-display region adjacent to thedisplay region, wherein the signal transmission region includes anelement area which a light-emitting element overlaps and a transmissionarea which the light-emitting element does not overlap; and anelectronic module below the display device, wherein the electronicmodule overlaps the signal transmission region, wherein the displaydevice includes: a display panel which includes a first non-foldingregion, a second non-folding region, and a folding region between thefirst non-folding region and the second non-folding region; and a lowermember below the display panel, wherein the lower member includes: asupport layer below the display panel, the support layer including afirst support part which overlaps the first non-folding region, a secondsupport part which overlaps the second non-folding region, and a foldingpart which overlaps the folding region, wherein a plurality of openingsis defined in the folding part; a digitizer below the support layer,wherein the digitizer corresponds to the first support part and thesecond support part; a cover layer between the support layer and thedigitizer, wherein the cover layer is attached below the folding part;and a lower adhesion layer between the support layer and the digitizer,wherein the lower adhesion layer is below the first support part and thesecond support part.
 19. The electronic device of claim 18, wherein thedisplay device further includes a window, wherein the window includes abase film and a bezel pattern which does not overlap the non-displayregion.
 20. The electronic device of claim 18, wherein the electronicmodule includes a camera module.